公开(公告)号：US20040118598A1

公开(公告)日：2004-06-24

申请号：US10379575

申请日：2003-03-06

申请人： Endicott Interconnect Technologies, Inc.

发明人： James W. Fuller JR. ,  John M. Lauffer ,  Voya R. Markovich

IPC分类号： H05K001/11

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

摘要翻译： 信息处理系统（例如，计算机，服务器等）利用至少一个具有坚固结构并具有增强的操作能力的电路化基板组件。 衬底组件包括具有至少一个开口的衬底，其在接合之前基本上填充有导电膏。 一旦粘合，糊料也部分地位于另一个开口内，以提供与其的有效电连接。

公开(公告)号：US20040150969A1

公开(公告)日：2004-08-05

申请号：US10354000

申请日：2003-01-30

申请人： Endicott Interconnect Technologies Inc.

发明人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K001/11

CPC分类号： H05K3/4688 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.

公开(公告)号：US20040231888A1

公开(公告)日：2004-11-25

申请号：US10811817

申请日：2004-03-30

申请人： Endicott Interconnect Technologies, Inc.

发明人： Benson Chan ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  David L. Thomas

IPC分类号： H05K001/00

CPC分类号： H05K3/4688 ,  H01L23/3128 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/113 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.

公开(公告)号：US20040177998A1

公开(公告)日：2004-09-16

申请号：US10811915

申请日：2004-03-30

申请人： Endicott Interconnect Technologies, Inc.

发明人： James W. Fuller JR. ,  John M. Lauffer ,  Voya R. Markovich

IPC分类号： H05K001/11 ,  H01R012/04 ,  H05K003/30

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

公开(公告)号：US20040118596A1

公开(公告)日：2004-06-24

申请号：US10322527

申请日：2002-12-19

申请人： Endicott Interconnect Technologies, Inc.

发明人： James W. Fuller JR. ,  John M. Lauffer ,  Voya R. Markovich

IPC分类号： H05K001/11

CPC分类号： H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

摘要翻译： 电路化基板组件及其制造方法，其中所述组件包括结合在一起的各个电路化基板。 基板各自包括至少一个开口，其中仅一个开口在接合之前基本上填充有导电浆料。 一旦粘合，糊料也部分地位于另一个开口内，以提供与其的有效电连接。