Invention Application
- Patent Title: Semiconductor light-emitting device and method for fabricating the same
- Patent Title (中): 半导体发光器件及其制造方法
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Application No.: US10817800Application Date: 2004-04-06
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Publication No.: US20040191938A1Publication Date: 2004-09-30
- Inventor: Daisuke Ueda , Shinichi Takigawa
- Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Current Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2001-281430 20010917
- Main IPC: H01L031/109
- IPC: H01L031/109

Abstract:
An n-type buffer layer composed of n-type GaN, an n-type cladding layer composed of n-type AlGaN, an n-type optical confinement layer composed of n-type GaN, a single quantum well active layer composed of undoped GaInN, a p-type optical confinement layer composed of p-type GaN, a p-type cladding layer composed of p-type AlGaN, and a p-type contact layer composed of p-type GaN are formed on a substrate composed of sapphire. A current blocking layer formed in an upper portion of the p-type cladding layer and on both sides of the p-type contact layer to define a ridge portion is composed of a dielectric material obtained by replacing some of nitrogen atoms composing a Group III-V nitride semiconductor with oxygen atoms.
Public/Granted literature
- US07170108B2 Semiconductor light-emitting device and method for fabricating the same Public/Granted day:2007-01-30
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