发明申请
- 专利标题: Polishing apparatus with abrasive tape, polishing method using abrasive tape and manufacturing method for magnetic disk
- 专利标题(中): 研磨带抛光装置,研磨用抛光方法及磁盘制造方法
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申请号: US10656926申请日: 2003-09-05
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公开(公告)号: US20040198181A1公开(公告)日: 2004-10-07
- 发明人: Fujio Tajima , Hideaki Amano , Teruaki Tokutomi , Takahisa Ishida , Kazuyuki Sonobe , Yasunori Fukuyama , Tsutomu Nagakura , Noritake Shizawa , Takeshi Sato
- 申请人: Hitachi Electronics Engineering Co. Ltd.
- 申请人地址: null
- 专利权人: Hitachi Electronics Engineering Co. Ltd.
- 当前专利权人: Hitachi Electronics Engineering Co. Ltd.
- 当前专利权人地址: null
- 优先权: JPP2003-71613 20030317
- 主分类号: B24B049/00
- IPC分类号: B24B049/00 ; B24B001/00 ; B24B007/19
摘要:
An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a vice voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.
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