Invention Application
US20040223883A1 System for determining characteristics of substrates employing fluid geometries
有权
用于确定采用流体几何形状的基板特性的系统
- Patent Title: System for determining characteristics of substrates employing fluid geometries
- Patent Title (中): 用于确定采用流体几何形状的基板特性的系统
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Application No.: US10863800Application Date: 2004-06-08
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Publication No.: US20040223883A1Publication Date: 2004-11-11
- Inventor: Byung J. Choi , Sidlgata V. Sreenivasan
- Applicant: MOLECULAR IMPRINTS, INC.
- Applicant Address: TX Austin
- Assignee: MOLECULAR IMPRINTS, INC.
- Current Assignee: MOLECULAR IMPRINTS, INC.
- Current Assignee Address: TX Austin
- Main IPC: G01N021/00
- IPC: G01N021/00
Abstract:
The present invention provides a system for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation between first and second spaced apart substrates.
Public/Granted literature
- US07036389B2 System for determining characteristics of substrates employing fluid geometries Public/Granted day:2006-05-02
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