发明申请
- 专利标题： Flip chip package with reinforced bumps
- 专利标题（中）： 翻转芯片包装与加强凸块
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申请号： US10809384申请日： 2004-03-26
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公开(公告)号： US20040227252A1公开(公告)日： 2004-11-18
- 发明人: Sung-Fei Wang
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaoshiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaoshiung
- 优先权： TW092109531 20030405
- 主分类号： H01L023/52
- IPC分类号： H01L023/52
摘要：
A flip chip package comprises a substrate, a chip, a plurality of electrically conductive bumps and reinforced bumps. The chip has an active surface having a central area and a peripheral area surrounding the central region. The electrically conductive bumps are disposed at the peripheral region of the chip to electrically connect to the substrate. In addition, the reinforced bumps are disposed at the central area of the chip. In such manner, it can enhance the connection between the chip and the substrate.
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