Invention Application
US20040227527A1 Method and relative test structure for measuring the coupling capacitance between two interconnect lines
有权
用于测量两条互连线之间的耦合电容的方法和相对测试结构
- Patent Title: Method and relative test structure for measuring the coupling capacitance between two interconnect lines
- Patent Title (中): 用于测量两条互连线之间的耦合电容的方法和相对测试结构
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Application No.: US10836827Application Date: 2004-04-30
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Publication No.: US20040227527A1Publication Date: 2004-11-18
- Inventor: Luca Bortesi , Loris Vendrame , Alessandro Bogliolo
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza (MI)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MI)
- Priority: EP03425282.5 20030502
- Main IPC: G01R027/26
- IPC: G01R027/26

Abstract:
A method and a relative test structure for measuring the coupling capacitance between two interconnect lines exploits the so-called cross-talk effect and keeps an interconnect line at a constant reference voltage. This approach addresses the problem of short-circuit currents that affect known test structures, and allows a direct measurement of the coupling capacitance between the two interconnect lines. Capacitance measurements may also be used for determining points of interruption of interconnect lines. When a line is interrupted, the measured coupling capacitance is the capacitance of a single conducting branch. The position of points of interruption of an interconnect line is determined by measuring the coupling capacitance of all segments of the line with a second conducting line.
Public/Granted literature
- US07352192B2 Method and relative test structure for measuring the coupling capacitance between two interconnect lines Public/Granted day:2008-04-01
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