发明申请
- 专利标题: Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
- 专利标题(中): 半导体结构,半导体器件,通信设备,集成电路及其制造方法
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申请号: US10878225申请日: 2004-06-29
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公开(公告)号: US20040232525A1公开(公告)日: 2004-11-25
- 发明人: Jamal Ramdani , Ravindranath Droopad , Lyndee L. Hilt , Kurt William Eisenbeiser
- 申请人: MOTOROLA, INC.
- 申请人地址: IL Schaumburg
- 专利权人: MOTOROLA, INC.
- 当前专利权人: MOTOROLA, INC.
- 当前专利权人地址: IL Schaumburg
- 主分类号: H01L021/331
- IPC分类号: H01L021/331
摘要:
High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
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