Invention Application
- Patent Title: Method for forming multilayer coating film
- Patent Title (中): 多层涂膜形成方法
-
Application No.: US10494779Application Date: 2004-05-05
-
Publication No.: US20040253449A1Publication Date: 2004-12-16
- Inventor: Satoru Ihara , Shinichi Ikehara , Shigeru Kuramochi , Wataru Tokami , Yoshiyuki Okamoto
- Priority: JP2001-339730 20011105
- Main IPC: C25D013/00
- IPC: C25D013/00 ; G01L009/18 ; B01D057/02 ; B05D001/36

Abstract:
The present invention provides a process for forming a plural layer coating film which is excellent in a chipping resistance and a corrosion resistance, characterized by comprising the steps of coating a cationically electrodepositable coating material (a) on an article to be coated and curing it by heating, then coating a water based thermoplastic chipping resistant coating material (b) and controlling a solid content in the coating film to 40% by weight or more, thereafter coating a water based intermediate coating material (c) and curing both coating films of the coating material (b) and the coating material (c) by heating and then coating a top coating material (d) and curing it.
Information query