Invention Application
- Patent Title: Electroplating compositions and methods
- Patent Title (中): 电镀组合物和方法
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Application No.: US10816627Application Date: 2004-04-02
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Publication No.: US20040253804A1Publication Date: 2004-12-16
- Inventor: Rozalia Beica , Neil D. Brown , Kai Wang
- Applicant: Rohm and Haas Electronic Materials, L.L.C.
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials, L.L.C.
- Current Assignee: Rohm and Haas Electronic Materials, L.L.C.
- Current Assignee Address: US MA Marlborough
- Main IPC: H01L021/00
- IPC: H01L021/00 ; H01L021/44 ; C25D013/00 ; G01L001/20
Abstract:
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
Public/Granted literature
- US07151049B2 Electroplating compositions and methods Public/Granted day:2006-12-19
Information query
