发明申请
- 专利标题： Fluid injection micro device and fabrication method thereof
- 专利标题（中）： 流体注射微型装置及其制造方法
-
申请号： US10877459申请日： 2004-06-25
-
公开(公告)号： US20050001884A1公开(公告)日： 2005-01-06
- 发明人: Hung-Sheng Hu , Wei-Lin Chen , Tsung-Ping Hsu
- 申请人： Hung-Sheng Hu , Wei-Lin Chen , Tsung-Ping Hsu
- 申请人地址： TW TAOYUAN
- 专利权人： BENQ CORPORATION
- 当前专利权人： BENQ CORPORATION
- 当前专利权人地址： TW TAOYUAN
- 优先权： TW92117543 20030627
- 主分类号： B41J2/14
- IPC分类号： B41J2/14 ; B41J2/16 ; H01L21/00
摘要：
A method for fabricating a fluid injection micro device. The method includes the steps of providing a substrate with an insulating layer thereon. A heater is formed on the insulating layer. A patterned conductive layer is formed on the heater and the insulating layer. A protective layer is formed on the conductive layer to insulate the conductive layer. An opening is formed by sequentially etching the protective layer, the insulating layer and the substrate. A patterned thick film, having a defined chamber, is formed on the protective layer. The back of the substrate is removed and thinned until the opening forms a through hole.
公开/授权文献
- US07264917B2 Fluid injection micro device and fabrication method thereof 公开/授权日：2007-09-04
信息查询
IPC分类:
