公开(公告)号：US06789880B2

公开(公告)日：2004-09-14

申请号：US10064254

申请日：2002-06-26

申请人： Chung-Cheng Chou ,  Tsung-Ping Hsu ,  In-Yao Lee ,  Wei-Lin Chen ,  Hung-Sheng Hu

发明人： Chung-Cheng Chou ,  Tsung-Ping Hsu ,  In-Yao Lee ,  Wei-Lin Chen ,  Hung-Sheng Hu

IPC分类号： B41J214

CPC分类号： B41J2/14137 ,  B41J2/1412 ,  B41J2002/1437

摘要： A microinjector uses bubbles as virtual valves to eject droplets of different sizes. The microinjector is in fluid communications with a reservoir and has a substrate, an orifice layer, and a plurality of nozzles. The substrate has a manifold for receiving ink from the reservoir. The orifice layer is positioned on the top of the substrate so that a plurality of chambers are formed between the orifice layer and the top of the substrate. Each of the nozzles has an orifice and at least three bubble generating components. The bubble generating components are selectively driven by a driving circuit so that each nozzle can eject droplets of different sizes.

摘要翻译： 微量注射器使用气泡作为虚拟阀来喷射不同尺寸的液滴。 微型注射器与储存器流体连通，并具有基底，孔层和多个喷嘴。 衬底具有用于从储存器接收墨水的歧管。 孔层位于基板的顶部，使得在孔板层和基板的顶部之间形成多个室。 每个喷嘴具有孔口和至少三个气泡产生部件。 气泡生成部件由驱动电路选择性地驱动，使得每个喷嘴可喷射不同尺寸的液滴。

公开(公告)号：US06733616B2

公开(公告)日：2004-05-11

申请号：US10063878

申请日：2002-05-21

申请人： Hung-Sheng Hu ,  Tsung-Ping Hsu ,  Wei-Lin Chen ,  Chung-Cheng Chou ,  In-Yao Lee

发明人： Hung-Sheng Hu ,  Tsung-Ping Hsu ,  Wei-Lin Chen ,  Chung-Cheng Chou ,  In-Yao Lee

IPC分类号： H05H100

CPC分类号： H01L21/67126 ,  H01L21/30604 ,  H01L21/31111 ,  H01L21/67086

摘要： A surface isolation device for isolating a predetermined area of a second surface of a wafer from an etching solution while the etching solution etches a first surface of the wafer to form a plurality of manifolds in the wafer. The surface isolation device has a base for positioning the wafer, a fixture for fixing the wafer on the base, and an isolation ring positioned on the base for isolating the predetermined area from the etching solution. When the fixture fixes the wafer on the base, the wafer sticks to the isolation ring, forming a seal that isolates the predetermined area from the etching solution.

摘要翻译： 一种表面隔离装置，用于在蚀刻溶液蚀刻晶片的第一表面以在晶片中形成多个歧管时，将晶片的第二表面的预定区域与蚀刻溶液隔离。 表面隔离装置具有用于定位晶片的基座，用于将晶片固定在基座上的固定器，以及位于基座上用于将预定区域与蚀刻溶液隔离的隔离环。 当夹具将晶片固定在基座上时，晶片粘附到隔离环上，形成将预定面积与蚀刻溶液隔离的密封。

公开(公告)号：US07439163B2

公开(公告)日：2008-10-21

申请号：US11355982

申请日：2006-02-17

申请人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu ,  Der-Rong Shyn

发明人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu ,  Der-Rong Shyn

IPC分类号： H01L21/20

CPC分类号： B41J2/14137 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631

摘要： Methods for fabricating fluid injection devices. A patterned sacrificial layer is formed on a substrate. A patterned first structural layer is formed on the substrate covering the sacrificial layer. At least one fluid actuator is formed on the structural layer. A first passivation layer is formed on the first structural covering the at least one fluid actuator. An under bump metal (UBM) layer is conformably formed on the first passivation layer. A patterned first photoresist is formed at a predetermined nozzle site and a contact opening site exposes the UBM layer. A second structural layer is formed on the UBM layer. An etching protective layer is formed on the second structural layer. The first photoresist is removed creating an opening at the nozzle site exposing the UBM layer. The UBM layer in the opening is removed.

摘要翻译： 制造流体注射装置的方法。 图案化的牺牲层形成在衬底上。 在覆盖牺牲层的基板上形成图案化的第一结构层。 在结构层上形成至少一个流体致动器。 在覆盖至少一个流体致动器的第一结构上形成第一钝化层。 在第一钝化层上顺应地形成凸块下金属（UBM）层。 在预定的喷嘴位置处形成图案化的第一光致抗蚀剂，并且接触开口部位露出UBM层。 在UBM层上形成第二结构层。 在第二结构层上形成蚀刻保护层。 去除第一光致抗蚀剂，在暴露UBM层的喷嘴位置产生开口。 开口中的UBM层被去除。

公开(公告)号：US20060284932A1

公开(公告)日：2006-12-21

申请号：US11372964

申请日：2006-03-09

申请人： Hung-Sheng Hu ,  Wei-Lin Chen ,  In-Yao Lee ,  Tsung-Ping Hsu ,  Chung-Cheng Chou ,  ShangShi Wu

发明人： Hung-Sheng Hu ,  Wei-Lin Chen ,  In-Yao Lee ,  Tsung-Ping Hsu ,  Chung-Cheng Chou ,  ShangShi Wu

IPC分类号： B41J2/04

CPC分类号： B41J2/14137 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49401

摘要： A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.

摘要翻译： 一种流体注射器及其制造方法。 流体注射器包括底座，第一通孔，气泡发生器，钝化层和金属层。 底座包括一个腔室和一个表面。 第一通孔与腔室连通，并设置在基座中。 气泡发生器设置在靠近第一通孔的表面上，并且位于室外。 钝化层设置在表面上。 金属层限定第二通孔，并且设置在室外的钝化层上。 第二通孔与第一通孔连通。

公开(公告)号：US20050001884A1

公开(公告)日：2005-01-06

申请号：US10877459

申请日：2004-06-25

申请人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu

发明人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu

IPC分类号： B41J2/14 ,  B41J2/16 ,  H01L21/00

CPC分类号： B41J2/1639 ,  B41J2/14137 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/1437

摘要： A method for fabricating a fluid injection micro device. The method includes the steps of providing a substrate with an insulating layer thereon. A heater is formed on the insulating layer. A patterned conductive layer is formed on the heater and the insulating layer. A protective layer is formed on the conductive layer to insulate the conductive layer. An opening is formed by sequentially etching the protective layer, the insulating layer and the substrate. A patterned thick film, having a defined chamber, is formed on the protective layer. The back of the substrate is removed and thinned until the opening forms a through hole.

摘要翻译： 一种制造流体注射微型装置的方法。 该方法包括以下步骤：在基底上提供绝缘层。 在绝缘层上形成加热器。 图案化导电层形成在加热器和绝缘层上。 在导电层上形成保护层以使导电层绝缘。 通过依次蚀刻保护层，绝缘层和基板来形成开口。 在保护层上形成具有限定腔室的图案化的厚膜。 去除基板的背面并变薄，直到开口形成通孔。

公开(公告)号：US06693045B2

公开(公告)日：2004-02-17

申请号：US09683692

申请日：2002-02-04

申请人： Tsung-Ping Hsu ,  In-Yao Lee ,  Hung-Sheng Hu ,  Chung-Cheng Chou ,  Wei-Lin Chen

发明人： Tsung-Ping Hsu ,  In-Yao Lee ,  Hung-Sheng Hu ,  Chung-Cheng Chou ,  Wei-Lin Chen

IPC分类号： H01L2100

CPC分类号： B81C1/00626 ,  B81C2201/0133 ,  B81C2201/016

摘要： A gradational etching method for high density wafer production. The gradational etching method acts on a substrate having a first passivation layer and a second passivation layer on a top surface and a bottom surface, respectively, of the substrate. A first etching process is performed to simultaneously etch the substrate and the first passivation layer to remove the first passivation layer. Finally, a second etching process is performed to etch the substrate to a designated depth that is used to control the thickness of the wafer after the second etching process.

摘要翻译： 用于高密度晶片生产的渐变蚀刻方法。 分级蚀刻方法分别作用于具有基板的顶表面和底表面上的第一钝化层和第二钝化层的基板上。 执行第一蚀刻工艺以同时蚀刻衬底和第一钝化层以去除第一钝化层。 最后，执行第二蚀刻工艺以将衬底蚀刻到用于在第二蚀刻工艺之后控制晶片的厚度的指定深度。

公开(公告)号：US06530648B2

公开(公告)日：2003-03-11

申请号：US10138291

申请日：2002-05-06

申请人： Yi-Jing Leu ,  Hung-Sheng Hu ,  Tsung-Ping Hsu ,  Wei-Lin Chen ,  In-Yao Lee ,  Chung-Cheng Chou

发明人： Yi-Jing Leu ,  Hung-Sheng Hu ,  Tsung-Ping Hsu ,  Wei-Lin Chen ,  In-Yao Lee ,  Chung-Cheng Chou

IPC分类号： B41J214

CPC分类号： B41J2/14129 ,  B41J2002/14177

摘要： An apparatus for using the bubble as a virtual valve to eject ink comprises a chamber, orifice, and heaters. The chamber, having a top surface and a bottom surface, is connected to the ink reservoir by a manifold. Two heaters, connected in series to a common electrode, are located on the bottom surface of the chamber. One heater having higher resistance is positioned adjacent to the manifold, and the other heater having lower resistance is positioned away from the manifold. When an electrical pulse is applied to activate the heaters, the heater close to the manifold heats up first, and generates a first bubble to isolate the ink flow between the chamber and manifold, thereby reducing the effects of cross talk. Subsequently, the heater away from the manifold generates the second bubble to pressurize the ink in the chamber with the first bubble, and the ink is ejected through the orifice. Then, the first bubble collapses, and breaks the isolation between the manifold and the chamber. The ink in the manifold immediately refills to the chamber.

公开(公告)号：US07513042B2

公开(公告)日：2009-04-07

申请号：US11372964

申请日：2006-03-09

申请人： Hung-Sheng Hu ,  Wei-Lin Chen ,  In-Yao Lee ,  Tsung-Ping Hsu ,  Chung-Cheng Chou ,  ShangShi Wu

发明人： Hung-Sheng Hu ,  Wei-Lin Chen ,  In-Yao Lee ,  Tsung-Ping Hsu ,  Chung-Cheng Chou ,  ShangShi Wu

IPC分类号： B21D53/76 ,  B41J2/04

CPC分类号： B41J2/14137 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49401

摘要： A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.

摘要翻译： 一种流体注射器及其制造方法。 流体注射器包括底座，第一通孔，气泡发生器，钝化层和金属层。 底座包括一个腔室和一个表面。 第一通孔与腔室连通，并设置在基座中。 气泡发生器设置在靠近第一通孔的表面上，并且位于室外。 钝化层设置在表面上。 金属层限定第二通孔，并且设置在室外的钝化层上。 第二通孔与第一通孔连通。

公开(公告)号：US07264917B2

公开(公告)日：2007-09-04

申请号：US10877459

申请日：2004-06-25

申请人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu

发明人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu

IPC分类号： B41J2/16

CPC分类号： B41J2/1639 ,  B41J2/14137 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/1437

摘要： A method for fabricating a fluid injection micro device. The method includes the steps of providing a substrate with an insulating layer thereon. A heater is formed on the insulating layer. A patterned conductive layer is formed on the heater and the insulating layer. A protective layer is formed on the conductive layer to insulate the conductive layer. An opening is formed by sequentially etching the protective layer, the insulating layer and the substrate. A patterned thick film, having a defined chamber, is formed on the protective layer. The back of the substrate is removed and thinned until the opening forms a through hole.

摘要翻译： 一种制造流体注射微型装置的方法。 该方法包括以下步骤：在基底上提供绝缘层。 在绝缘层上形成加热器。 图案化导电层形成在加热器和绝缘层上。 在导电层上形成保护层以使导电层绝缘。 通过依次蚀刻保护层，绝缘层和基板来形成开口。 在保护层上形成具有限定室的图案化的厚膜。 去除基板的背面并变薄，直到开口形成通孔。

公开(公告)号：US20060258138A1

公开(公告)日：2006-11-16

申请号：US11355982

申请日：2006-02-17

申请人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu ,  Der-Rong Shyn

发明人： Hung-Sheng Hu ,  Wei-Lin Chen ,  Tsung-Ping Hsu ,  Der-Rong Shyn

IPC分类号： H01L21/44

CPC分类号： B41J2/14137 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631

摘要： Methods for fabricating fluid injection devices. A patterned sacrificial layer is formed on a substrate. A patterned first structural layer is formed on the substrate covering the sacrificial layer. At least one fluid actuator is formed on the structural layer. A first passivation layer is formed on the first structural covering the at least one fluid actuator. An under bump metal (UBM) layer is conformably formed on the first passivation layer. A patterned first photoresist is formed at a predetermined nozzle site and a contact opening site exposes the UBM layer. A second structural layer is formed on the UBM layer. An etching protective layer is formed on the second structural layer. The first photoresist is removed creating an opening at the nozzle site exposing the UBM layer. The UBM layer in the opening is removed.

摘要翻译： 制造流体注射装置的方法。 图案化的牺牲层形成在衬底上。 在覆盖牺牲层的基板上形成图案化的第一结构层。 在结构层上形成至少一个流体致动器。 在覆盖至少一个流体致动器的第一结构上形成第一钝化层。 在第一钝化层上顺应地形成凸块下金属（UBM）层。 在预定的喷嘴位置处形成图案化的第一光致抗蚀剂，并且接触开口部位露出UBM层。 在UBM层上形成第二结构层。 在第二结构层上形成蚀刻保护层。 去除第一光致抗蚀剂，在暴露UBM层的喷嘴位置产生开口。 开口中的UBM层被去除。