Invention Application
- Patent Title: Method of producing a multi-layered wiring board
- Patent Title (中): 多层布线板的制造方法
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Application No.: US10893938Application Date: 2004-07-20
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Publication No.: US20050003076A1Publication Date: 2005-01-06
- Inventor: Toshiyuki Toyoshima , Satoshi Yanaura , Yasuo Furuhashi , Hirofumi Fujioka
- Applicant: Toshiyuki Toyoshima , Satoshi Yanaura , Yasuo Furuhashi , Hirofumi Fujioka
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Priority: JP2000-097250 20000331
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/40 ; H05K3/46 ; H01L23/02 ; H05K3/42
Abstract:
Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.
Public/Granted literature
- US07100275B2 Method of producing a multi-layered wiring board Public/Granted day:2006-09-05
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