发明申请
- 专利标题： Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
- 专利标题（中）： 半导体装置，电子装置，电子装置以及半导体装置的制造方法
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申请号： US10852860申请日： 2004-05-25
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公开(公告)号： US20050006784A1公开(公告)日： 2005-01-13
- 发明人: Toshinori Nakayama
- 申请人： Toshinori Nakayama
- 专利权人： SEIKO EPSON CORPORATION
- 当前专利权人： SEIKO EPSON CORPORATION
- 优先权： JP2003-155889 20030530
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L23/31 ; H01L23/48 ; H01L25/065 ; H01L25/10 ; H01L25/11 ; H01L23/02
摘要：
A semiconductor device includes a first semiconductor package, in which a first semiconductor chip is mounted and a second semiconductor package, in which a second semiconductor chip is mounted and which is supported above the first semiconductor package so as to extend off the first semiconductor package.