Invention Application
- Patent Title: Alternating voided areas of anti-pads
- Patent Title (中): 交替排空区域的防磨垫
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Application No.: US10621925Application Date: 2003-07-17
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Publication No.: US20050011676A1Publication Date: 2005-01-20
- Inventor: Andrew Barr , Dale Shidla , Robert Dobbs
- Applicant: Andrew Barr , Dale Shidla , Robert Dobbs
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/42 ; H05K3/46 ; H05K7/06
Abstract:
A printed circuit board comprises a first conductive plane and a second conductive plane substantially parallel to the first conductive plane. The printed circuit board comprises a via signal barrel transecting the first and second conductive planes and a first anti-pad positioned between the first conductive plane and the via signal barrel. The first anti-pad has a first voided area. The printed circuit board comprises a second anti-pad positioned between the second conductive plane and the via signal barrel. The second anti-pad has a second voided area. The first voided area does not completely overlap the second voided area.
Public/Granted literature
- US07141742B2 Alternating voided areas of anti-pads Public/Granted day:2006-11-28
Information query
