发明申请
US20050012157A1 Semiconductor device having sufficient process margin and method of forming same
有权
具有足够的加工余量的半导体器件及其形成方法
- 专利标题: Semiconductor device having sufficient process margin and method of forming same
- 专利标题(中): 具有足够的加工余量的半导体器件及其形成方法
-
申请号: US10892588申请日: 2004-07-15
-
公开(公告)号: US20050012157A1公开(公告)日: 2005-01-20
- 发明人: Man-Hyoung Ryoo , Gi-Sung Yeo , Si-Hyeung Lee , Gyu-Chul Kim , Sung-Gon Jung , Chang-Min Park , Hoo-Sung Cho
- 申请人: Man-Hyoung Ryoo , Gi-Sung Yeo , Si-Hyeung Lee , Gyu-Chul Kim , Sung-Gon Jung , Chang-Min Park , Hoo-Sung Cho
- 优先权: KR2003-48223 20030715
- 主分类号: G11C11/34
- IPC分类号: G11C11/34 ; G11C11/412 ; H01L27/02 ; H01L27/11
摘要:
According to some embodiments of the invention, a substrate doped with a P type impurity is provided. An N type impurity is doped into the substrate to divide the substrate into a P type impurity region and an N type impurity region. Active patterns having a first pitch are formed in the P type and N type impurity regions. Gate patterns having a second pitch are formed on the active patterns in a direction substantially perpendicular to the active patterns. Other embodiments are described and claimed.
公开/授权文献
信息查询