发明申请
US20050012157A1 Semiconductor device having sufficient process margin and method of forming same 有权
具有足够的加工余量的半导体器件及其形成方法

Semiconductor device having sufficient process margin and method of forming same
摘要:
According to some embodiments of the invention, a substrate doped with a P type impurity is provided. An N type impurity is doped into the substrate to divide the substrate into a P type impurity region and an N type impurity region. Active patterns having a first pitch are formed in the P type and N type impurity regions. Gate patterns having a second pitch are formed on the active patterns in a direction substantially perpendicular to the active patterns. Other embodiments are described and claimed.
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