Invention Application
US20050013533A1 Micro mirror arrays and microstructures with solderable connection sites 失效
具有可焊接连接点的微镜阵列和微结构

Micro mirror arrays and microstructures with solderable connection sites
Abstract:
A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and coupled to the upper wafer portion. The lower wafer portion includes at least one connection site located thereon, the at least one connection site being electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion.
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