发明申请
- 专利标题： Substrate holder and plating apparatus
- 专利标题（中）： 基板支架和电镀装置
-
申请号： US10482476申请日： 2003-06-20
-
公开(公告)号： US20050014368A1公开(公告)日： 2005-01-20
- 发明人: Junichiro Yoshioka , Kuniaki Horie , Yugang Guo , Satoshi Morikami
- 申请人： Junichiro Yoshioka , Kuniaki Horie , Yugang Guo , Satoshi Morikami
- 优先权： JP2002-182236 20020621; JP2002-213208 20020722; JP2002-213209 20020722
- 国际申请： PCT/JP03/07885 WO 20030620
- 主分类号： C25D7/12
- IPC分类号： C25D7/12 ; C25D17/06 ; H01L21/00 ; H01L21/288 ; H01L21/60 ; H01L21/687 ; H01L21/302
摘要：
The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of it easily and securely, and also a plating apparatus provided with the substrate holder. A substrate holder (18), includes: a fixed holding member (54) and a movable holding member (58) for holding a substrate (W) therebetween; a sealing member (68) mounted to the fixed holding member (54) or the movable holding member (58); and a suction pad (94) for attracting a back surface of the substrate (W) held between the fixed holding member (54) and the movable holding member (58).
公开/授权文献
- US07601248B2 Substrate holder and plating apparatus 公开/授权日：2009-10-13
信息查询
