发明申请
- 专利标题： High permeability composite films to reduce noise in high speed interconnects
- 专利标题（中）： 高磁导率复合薄膜可降低高速互连中的噪声
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申请号： US10914331申请日： 2004-08-09
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公开(公告)号： US20050017327A1公开(公告)日： 2005-01-27
- 发明人: Leonard Forbes , Kie Ahn , Salman Akram
- 申请人： Leonard Forbes , Kie Ahn , Salman Akram
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 主分类号： G11C7/18
- IPC分类号： G11C7/18 ; H01L23/522 ; H01P5/12
摘要：
A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The transmission line circuit includes forming a second layer of electrically conductive material on the second layer of insulating material.
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