发明申请
US20050022378A1 Apparatus used to package multimedia card by transfer molding
审中-公开
用于通过传递成型封装多媒体卡的装置
- 专利标题： Apparatus used to package multimedia card by transfer molding
- 专利标题（中）： 用于通过传递成型封装多媒体卡的装置
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申请号： US10927678申请日： 2004-08-26
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公开(公告)号： US20050022378A1公开(公告)日： 2005-02-03
- 发明人: Todd Bolken
- 申请人： Todd Bolken
- 主分类号： B29C45/14
- IPC分类号： B29C45/14 ; H01L21/56 ; H01L23/31 ; H05K3/00 ; H05K3/28 ; H01L21/44 ; H01L23/02 ; H05K3/34
摘要：
A semiconductor card is made by an apparatus using a method which in one molding step forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral opening. The connecting segments are motivated downward by pins outside of the card periphery, holding the substrate against a lower level of the mold cavity during molding. Molded wings extending laterally from the card periphery are also formed. Following molding and curing, the casting is removed and the card singulated by excising the wings from the card. The resulting card has smooth edge surfaces and precise dimensions. Separate glob top encapsulation is avoided.
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