Invention Application
- Patent Title: Image sensor package fabrication method
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Application No.: US10928475Application Date: 2004-08-26
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Publication No.: US20050024752A1Publication Date: 2005-02-03
- Inventor: Steven Webster
- Applicant: Steven Webster
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Main IPC: G02B7/02
- IPC: G02B7/02 ; H01J3/14 ; H01L27/00 ; H01L27/14 ; H01L27/146 ; H04N5/225 ; H04N5/335 ; H01J40/14 ; H01J5/02 ; H01J5/16

Abstract:
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
Public/Granted literature
- US06956201B2 Image sensor package fabrication method Public/Granted day:2005-10-18
Information query
IPC分类:
G | 物理 |
G02 | 光学 |
G02B | 光学元件、系统或仪器 |
G02B7/00 | 光学元件的安装、调整装置或不漏光连接 |
G02B7/02 | .用于透镜 |