Invention Application
- Patent Title: Flip chip package structure
- Patent Title (中): 倒装芯片封装结构
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Application No.: US10899870Application Date: 2004-07-27
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Publication No.: US20050029672A1Publication Date: 2005-02-10
- Inventor: Hung-Ta Hsu , Tzu-Bin Lin , Ya-Ling Huang
- Applicant: Hung-Ta Hsu , Tzu-Bin Lin , Ya-Ling Huang
- Priority: TW092121729 20030807
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/36 ; H01L23/42 ; H01L23/02
Abstract:
A flip chip package structure includes a substrate, a chip, solder bumps, a heat sink, a thermal interface material (TIM), and solder balls. The substrate has an upper surface and a lower surface and further has a receiving area. The receiving area has a bottom in the substrate and an opening formed on the upper surface. Several solder bumps are disposed in the receiving area. The chip is disposed on the upper surface of the substrate, and covers the opening. The front surface of the chip is electrically coupled to the bottom via the solder bumps. The heat sink is attached to the upper surface of the substrate and the back surface of the chip through the adhesion of TIM. Several solder balls are disposed on the lower surface of the substrate.
Public/Granted literature
- US07005749B2 Flip chip package structure Public/Granted day:2006-02-28
Information query
IPC分类:
