发明申请
- 专利标题： Method for precise molding and alignment of structures on a substrate using a stretchable mold
- 专利标题（中）： 使用可拉伸模具精确模制和对准基板上的结构的方法
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申请号： US10936420申请日： 2004-09-08
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公开(公告)号： US20050029942A1公开(公告)日： 2005-02-10
- 发明人: Raymond Chiu , Timothy Hoopman , Paul Humpal , Vincent King , Kenneth Dillon
- 申请人： Raymond Chiu , Timothy Hoopman , Paul Humpal , Vincent King , Kenneth Dillon
- 专利权人： 3M Innovative Properties Company
- 当前专利权人： 3M Innovative Properties Company
- 主分类号： H01J9/02
- IPC分类号： H01J9/02 ; B29C33/30 ; B29C33/40 ; B29C33/42 ; H01J9/24 ; H01J11/02 ; H01L21/027 ; H01J17/49
摘要：
A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
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