发明申请
US20050032271A1 Lead frame, semiconductor device using the same and method of producing the semiconductor device
失效
引线框架，使用其的半导体器件和制造半导体器件的方法
- 专利标题： Lead frame, semiconductor device using the same and method of producing the semiconductor device
- 专利标题（中）： 引线框架，使用其的半导体器件和制造半导体器件的方法
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申请号： US10936795申请日： 2004-09-09
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公开(公告)号： US20050032271A1公开(公告)日： 2005-02-10
- 发明人: Takekazu Tanaka
- 申请人： Takekazu Tanaka
- 申请人地址： JP KANAGAWA
- 专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人： NEC ELECTRONICS CORPORATION
- 当前专利权人地址： JP KANAGAWA
- 优先权： JP2001-163268 20010530
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/31 ; H01L23/495 ; H01L23/50 ; H01L21/44 ; H01L21/50
摘要：
A lead frame of the present invention includes a pair of base portions having a substantially flat bottom each. An island portion and electrode portions are partly connected to the tops of the base portions. The lead frame needs a minimum of production cost and promotes dense mounting of semiconductor devices to a circuit board.
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