发明申请
- 专利标题： Low thermal expansion materials
- 专利标题（中）： 低热膨胀材料
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申请号： US10885950申请日： 2004-07-08
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公开(公告)号： US20050032625A1公开(公告)日： 2005-02-10
- 发明人: Atsushi Omote , Tomoko Suzuki , Masa-aki Suzuki
- 申请人： Atsushi Omote , Tomoko Suzuki , Masa-aki Suzuki
- 申请人地址： JP Osaka
- 专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址： JP Osaka
- 优先权： JP2003-5694 20030114
- 主分类号： C01G39/00
- IPC分类号： C01G39/00 ; C01G41/00 ; C04B35/495 ; C04B35/486
摘要：
It is a principal object of the present invention to provide low thermal expansion materials able to answer to the needs of various uses. The present invention relates to low thermal expansion materials constituted substantially from a crystalline body represented by a compositional formula RM(QO4)3, wherein R represents at least one selected from Zr and Hf, M represents at least one selected from Mg, Ca, Sr, Ba and Ra, and Q represents at least one selected from W and Mo.
公开/授权文献
- US07049257B2 Low thermal expansion materials 公开/授权日：2006-05-23
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