发明申请
- 专利标题： Semiconductor package with heat dissipating structure
- 专利标题（中）： 具有散热结构的半导体封装
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申请号： US10759863申请日： 2004-01-16
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公开(公告)号： US20050036291A1公开(公告)日： 2005-02-17
- 发明人: Chien-Ping Huang , Han-Ping Pu , Chin-Te Chen , Chang-Fu Lin
- 申请人： Chien-Ping Huang , Han-Ping Pu , Chin-Te Chen , Chang-Fu Lin
- 申请人地址： TW Taichung Hsien
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW Taichung Hsien
- 优先权： TW092122067 20030812
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/56 ; H01L23/055 ; H01L23/10 ; H01L23/367 ; H01L23/467 ; H01L25/065 ; H05K7/20
摘要：
A semiconductor package with a heat dissipating structure includes a substrate, a chip and a heat dissipating structure. The chip is mounted on and electrically connected to the substrate. The heat dissipating structure includes a first heat sink having at least one positioning portion, and at least one second heat sink having at least one second positioning portion and at least one hollow portion. The second heat sink is mounted on the substrate, and the first positioning portion of the first heat sink is attached to the second positioning portion of the second heat sink, allowing the chip to be accommodated in a space defined by the first heat sink, the hollow portion of the second heat sink and the substrate. This semiconductor package has good heat dissipating efficiency and is cost-effective to fabricate.
公开/授权文献
- US06980438B2 Semiconductor package with heat dissipating structure 公开/授权日：2005-12-27
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