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    Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems
    3.
    发明授权
    Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems 有权
    具有指令预取设备的嵌入式系统，以及用于在嵌入式系统中取指令的方法

    公开(公告)号：US07299341B2

    公开(公告)日：2007-11-20

    申请号：US11419202

    申请日：2006-05-19

    Applicant: Chang-Fu Lin

    Inventor： Chang-Fu Lin

    IPC: G06F12/00

    CPC classification number: G06F9/3802 ,  G06F9/3808

    Abstract: In a method for fetching instructions in an embedded system, a predicted one of a set of the instructions stored in a memory device is fetched and is subsequently stored in an instruction buffer when a system bus is in a data access phase. When a processor generates an access request for the memory device, the predicted one of the instructions stored in the instruction buffer is provided to the system bus for receipt by the processor upon determining that the predicted one of the instructions stored in the instruction buffer hits the access request from the processor. An embedded system with an instruction prefetching device is also disclosed.

    Abstract translation: 在用于在嵌入式系统中取指令的方法中，当系统总线处于数据访问阶段时，存储在存储器件中的一组指令中的预测的一个指令被取出并随后被存储在指令缓冲器中。 当处理器产生对存储器件的访问请求时，存储在指令缓冲器中的指令中的预测的一个指令被提供给系统总线，以便在确定存储在指令缓冲器中的预测指令之一被命中时被处理器接收 来自处理器的访问请求。 还公开了一种具有指令预取装置的嵌入式系统。

    Heat dissipating structure and semiconductor package with the same
    4.
    发明授权
    Heat dissipating structure and semiconductor package with the same 有权
    散热结构和半导体封装相同

    公开(公告)号：US07203072B2

    公开(公告)日：2007-04-10

    申请号：US10851288

    申请日：2004-05-21

    Applicant: Chin-Te Chen ,  Chang-Fu Lin

    Inventor： Chin-Te Chen ,  Chang-Fu Lin

    IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC classification number: H01L23/10 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/16315 ,  H01L2924/00

    Abstract: A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.

    Abstract translation: 提出了一种散热结构及其半导体封装。 衬底用于容纳至少一个芯片，芯片电连接至衬底。 具有平坦部分和支撑部分的散热结构通过粘合剂经由支撑部分安装在基板上。 在支撑部分上形成至少一个凹槽，并且围绕凹槽形成至少一个排气孔，以允许凹槽经由排气口与外部连通，使得允许粘合剂填充凹槽以从空气中排出空气 通过排气口到大气中，从而防止空气被捕获在槽中。

    Semiconductor package with heat sink
    5.
    发明授权
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US07057276B2

    公开(公告)日：2006-06-06

    申请号：US10690921

    申请日：2003-10-21

    Applicant: Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

    Inventor： Chang-Fu Lin ,  Han-Ping Pu ,  Chien-Ping Huang

    IPC: H01L23/10 ,  H01L23/34

    CPC classification number: H01L23/367 ,  H01L23/3672 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2224/05599

    Abstract: A semiconductor package with a heat sink is provided. At least one chip and a heat sink attached to the chip are mounted on a substrate. At least one slot is formed through at least one corner of the heat sink at a position attached to the substrate. An adhesive material is applied between the heat sink and substrate and over filled in the slot with an overflow of the adhesive material out of the slot. The adhesive material over filled in the slot provides an anchoring effect and increases its contact area with the heat sink to thereby firmly secure the heat sink on the substrate. Further, the slot formed at the corner of the heat sink can alleviate thermal stresses accumulated at the corner of the heat sink and thereby prevent delamination between the heat sink and the substrate.

    Abstract translation: 提供了具有散热器的半导体封装。 连接到芯片的至少一个芯片和散热片安装在基板上。 在连接到基板的位置处，通过散热器的至少一个角部形成至少一个槽。 将粘合剂材料施加在散热器和衬底之间并且在填充在槽中并且粘合剂材料溢出出槽之外。 填充在槽中的粘合剂材料提供锚定效果并增加其与散热器的接触面积，从而将散热器牢固地固定在基板上。 此外，形成在散热器角落处的槽可以减轻积聚在散热器拐角处的热应力，从而防止散热器和基板之间的分层。

    Flip-chip semiconductor package and package substrate applicable thereto
    7.
    发明申请
    Flip-chip semiconductor package and package substrate applicable thereto 审中-公开
    倒装芯片半导体封装和适用于其的封装基板

    公开(公告)号：US20080277802A1

    公开(公告)日：2008-11-13

    申请号：US12151904

    申请日：2008-05-08

    Applicant: Kuo-Ching Tsai ,  Chang-Fu Lin

    Inventor： Kuo-Ching Tsai ,  Chang-Fu Lin

    IPC: H01L23/488

    CPC classification number: H01L21/563 ,  H01L24/28 ,  H01L2224/13099 ,  H01L2224/14132 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/83365 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A flip-chip semiconductor package structure and a package substrate applicable thereto are disclosed. The package substrate includes a body having at least a chip-attach area disposed thereon; a plurality of solder pads disposed in the chip-attach area and arranged at different intervals; and a fluid-disturbing portion disposed in the chip-attach area at a position where the solder pads are loosely arranged. A flip-chip semiconductor chip is mounted on the solder pads via conductive bumps and an underfill material is filled between the package substrate and the flip-chip semiconductor chip, the underfill material encapsulating the conductive bumps and the fluid-disturbing portion. By protrudingly disposing the fluid-disturbing portion at a position where the conductive bumps are loosely arranged, that is, the conductive bumps having bigger intervals therebetween, gap between the package substrate and the flip-chip semiconductor chip can be reduced so as to increase capillary attraction generated by capillary phenomenon, thereby balancing flow rate of the underfill material between the conductive bumps that are arranged at different intervals and thus avoiding problems of void formation, subsequent popcorn effect or delamination as encountered in the prior art.

    Abstract translation: 公开了一种倒装芯片半导体封装结构和可应用于其的封装衬底。 封装基板包括：至少设置有芯片附着区域的主体; 多个焊盘，设置在芯片附着区域中并以不同的间隔布置; 以及布置在所述芯片附着区域中的焊料松散布置的位置处的流体干扰部分。 通过导电凸块将倒装芯片半导体芯片安装在焊盘上，并且在封装衬底和倒装芯片半导体芯片之间填充底部填充材料，封装有导电凸块和流体干扰部分的底部填充材料。 通过将导体凸块松动配置的位置突出地配置，即，导电性凸起间隔较大的间隙，可以减小封装基板与倒装芯片半导体芯片之间的间隙，从而增加毛细管 由毛细管现象产生的吸引力，从而平衡以不同间隔布置的导电凸块之间的底部填充材料的流速，从而避免了现有技术中遇到的空隙形成问题，随后的爆米花效应或分层现象。

    Heat-dissipating structure and heat-dissipating semiconductor package having the same
    8.
    发明申请
    Heat-dissipating structure and heat-dissipating semiconductor package having the same 有权
    散热结构及其散热半导体封装

    公开(公告)号：US20080142955A1

    公开(公告)日：2008-06-19

    申请号：US12001612

    申请日：2007-12-11

    Applicant: Chin-Te Chen ,  Ke-Chuan Yang ,  Chang-Fu Lin

    Inventor： Chin-Te Chen ,  Ke-Chuan Yang ,  Chang-Fu Lin

    IPC: H01L23/373

    CPC classification number: H01L23/367 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A heat-dissipating structure and a heat-dissipating semiconductor package having the same are disclosed in the present invention. The heat-dissipating semiconductor package includes a chip carrier, a flip chip semiconductor chip attached and electrically connected to the chip carrier, and a heat sink bonded to the flip chip semiconductor chip via a thermal interface material, such as a solder material, wherein a groove is formed on the heat sink around the bonding area of the thermal interface material, and a blocking layer, such as a metal oxide layer, is formed on the surface of the groove to reduce the wetting capability of the thermal interface material, thus further prevents the thermal interface material from wetting the groove in the fusion process performed the thermal interface material, therefore, it ensures the thermal interface material has sufficient thickness for forming solder bonding between the heat sink and the flip chip semiconductor chip.

    Abstract translation: 在本发明中公开了一种散热结构和具有该散热结构的散热半导体封装。 散热半导体封装包括芯片载体，安装并电连接到芯片载体的倒装芯片半导体芯片，以及通过诸如焊料材料的热界面材料接合到倒装芯片半导体芯片的散热器，其中a 在热界面材料的接合区域周围的散热器上形成凹槽，并且在凹槽的表面上形成诸如金属氧化物层的阻挡层，以降低热界面材料的润湿能力，因此进一步 防止热界面材料在进行热界面材料的熔融过程中润湿槽，因此，确保热界面材料具有足够的厚度，用于在散热器和倒装芯片半导体芯片之间形成焊接。

    Semiconductor package with heat sink
    10.
    发明授权
    Semiconductor package with heat sink 有权
    半导体封装带散热片

    公开(公告)号：US07177155B2

    公开(公告)日：2007-02-13

    申请号：US11212290

    申请日：2005-08-26

    Applicant: Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

    Inventor： Chang-Fu Lin ,  Han-Ping Pu ,  Cheng-Hsu Hsiao ,  Chien Ping Huang

    IPC: H05K7/20 ,  H01L23/34

    CPC classification number: H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2924/00014

    Abstract: A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

    Abstract translation: 提供了具有散热器的半导体封装，其中至少一个芯片安装在基板上并被散热器覆盖。 散热器在与基板接触的位置处形成有多个凹槽或孔，允许将粘合材料施加在散热器和基板之间并填充到用于将散热器附接到基板上的凹槽或孔中。 填充到槽或孔中的粘合剂材料提供了将散热器牢固地定位在基板上的锚固效果。 因此，不需要在基板上形成预定的孔，用于连接诸如螺栓的固定构件，并且散热器的结合不会影响迹线布线性以及衬底上的诸如焊球的输入/输出连接的布置 不会导致芯片的裂纹。

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