Invention Application
US20050045580A1 Method of fabricating electronic component using resist structure with no undercut 有权
使用没有底切的抗蚀剂结构制造电子部件的方法

Method of fabricating electronic component using resist structure with no undercut
Abstract:
A method for milling a structure. A single- or multi-layer resist having no undercut is added to a surface of a structure to be milled, the surface to be milled defining a plane. A milling process, such as ion milling, is performed. The milling process includes milling the structure at high incidence and milling the structure at razing incidence. The milling process can be performed only once, or repeated multiple times. High incidence can be defined as about 65 to about 90 degrees from the plane of the surface being milled. Razing incidence can be defined as about 0 to about 30 degrees from the plane of the surface being milled.
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