Invention Application
US20050046087A1 Applicator device, mold, molding process for the device, and kit including the device
有权
涂布器装置,模具,装置的成型工艺和包括该装置的工具包
- Patent Title: Applicator device, mold, molding process for the device, and kit including the device
- Patent Title (中): 涂布器装置,模具,装置的成型工艺和包括该装置的工具包
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Application No.: US10893294Application Date: 2004-07-19
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Publication No.: US20050046087A1Publication Date: 2005-03-03
- Inventor: Vincent De Laforcade
- Applicant: Vincent De Laforcade
- Priority: FR0308802 20030718
- Main IPC: A45D19/00
- IPC: A45D19/00 ; A45D19/02 ; A45D40/26 ; A46B1/00 ; A46B9/02 ; A46D3/00 ; B29C45/00 ; B29C45/26 ; B29C45/44 ; B29C45/64 ; B29D1/00

Abstract:
Various embodiments of a device for applying a product are discloses. The device may include a support member and at least two separate applicator members extending from the support member. The applicator members and the support member may be defined by a single piece of material. The applicator members may include a first applicator member extending substantially rectilinearly along a principal lengthwise axis, and a second applicator member comprising a base portion extending in a direction substantially parallel to the principal lengthwise axis, and a terminal portion extending along an intersecting axis that intersects with said principal lengthwise axis. Moreover, a mold for making the device and a method of making the device are disclosed.
Public/Granted literature
- US07481227B2 Applicator device, mold, molding process for the device, and kit including the device Public/Granted day:2009-01-27
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