发明申请
- 专利标题： Surface acoustic wave device and method for manufacturing the same
- 专利标题（中）： 表面声波装置及其制造方法
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申请号： US10922032申请日： 2004-08-19
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公开(公告)号： US20050046307A1公开(公告)日： 2005-03-03
- 发明人: Kenji Sakaguchi , Kenji Akiyama
- 申请人： Kenji Sakaguchi , Kenji Akiyama
- 优先权： JP2003-310342 20030902; JP2004-209035 20040715
- 主分类号： H03H9/25
- IPC分类号： H03H9/25 ; H03H3/08 ; H03H9/05 ; H03H9/145
摘要：
A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) electrode, and a connecting portion that is electrically connected with the IDT electrode. The surface acoustic wave device further includes a wiring portion, a portion of which is disposed on the connecting portion, and a bump disposed on the wiring portion. The connecting portion includes a comb-shaped portion at an end of the connecting portion on which the wiring portion is disposed.