Invention Application
US20050047094A1 Heat sink structure with embedded electronic components for semiconductor package
有权
带散热器结构的嵌入式电子元件用于半导体封装
- Patent Title: Heat sink structure with embedded electronic components for semiconductor package
- Patent Title (中): 带散热器结构的嵌入式电子元件用于半导体封装
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Application No.: US10772042Application Date: 2004-02-03
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Publication No.: US20050047094A1Publication Date: 2005-03-03
- Inventor: Shih-Ping Hsu , Lin-Yin Wong
- Applicant: Shih-Ping Hsu , Lin-Yin Wong
- Priority: TW092123709 20030828
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L25/065 ; H05K7/20
Abstract:
A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at least one semiconductor chip therein. This arrangement enhances electric performance of a semiconductor package with the above heat sink structure and improves heat dissipating efficiency of the semiconductor package.
Public/Granted literature
- US07050304B2 Heat sink structure with embedded electronic components for semiconductor package Public/Granted day:2006-05-23
Information query
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