发明申请
- 专利标题: Inspection system, inspection method, and process management method
- 专利标题(中): 检验制度,检验方法和流程管理方法
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申请号: US10885725申请日: 2004-07-08
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公开(公告)号: US20050051722A1公开(公告)日: 2005-03-10
- 发明人: Hiroshi Makino , Hisaya Murakoshi , Hiroyuki Shinada , Hideo Todokoro
- 申请人: Hiroshi Makino , Hisaya Murakoshi , Hiroyuki Shinada , Hideo Todokoro
- 优先权: JP2003-317700 20030910
- 主分类号: G01B15/00
- IPC分类号: G01B15/00 ; G01B15/08 ; G01N23/04 ; G01N23/225 ; H01J37/21 ; H01J37/22 ; H01J37/29 ; H01L21/66 ; G01N23/00
摘要:
The present invention relates to an inspection apparatus comprising: an electron emitting unit for sequentially emitting an electron beam in the direction of the inspection area of a sample; a decelerating means for drawing back the electron beam in the vicinity of the inspection area; an imaging unit for forming images of the electron beam, which has been drawn back in the vicinity of the inspection area, on multiple different image forming conditions; an image detecting unit for capturing the electron beam that formed an image corresponding to each image forming condition and an image processing unit for comparing the images on different image forming conditions with one another to thereby detect a defect in the inspection area.
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