发明申请
US20050051789A1 Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same 有权
用于半导体发光器件的固体金属块安装基板及其制造方法

  • 专利标题: Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
  • 专利标题(中): 用于半导体发光器件的固体金属块安装基板及其制造方法
  • 申请号: US10659108
    申请日: 2003-09-09
  • 公开(公告)号: US20050051789A1
    公开(公告)日: 2005-03-10
  • 发明人: Gerald NegleyBan Loh
  • 申请人: Gerald NegleyBan Loh
  • 主分类号: H01L33/48
  • IPC分类号: H01L33/48 H01L29/22
Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same
摘要:
A mounting substrate for a semiconductor light emitting device includes a solid metal block having a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. An insulating coating is provided in the cavity, and first and second spaced apart conductive traces are provided on the insulating coating in the cavity that are configured for connection to a semiconductor light emitting device. The mounting substrate may be fabricated by providing a solid aluminum block including a cavity in a face thereof that is configured for mounting a semiconductor light emitting device therein. The solid aluminum block is oxidized to form an aluminum oxide coating thereon. The first and second spaced apart electrical traces are fabricated on the aluminum oxide coating in the cavity.
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