发明申请
- 专利标题: Process for producing wiring circuit board
- 专利标题(中): 制造布线电路板的工艺
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申请号: US10934703申请日: 2004-09-07
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公开(公告)号: US20050053868A1公开(公告)日: 2005-03-10
- 发明人: Toshiki Naito
- 申请人: Toshiki Naito
- 专利权人: NITTO DENKO CORPORATION
- 当前专利权人: NITTO DENKO CORPORATION
- 优先权: JPP.2003-315634 20030908
- 主分类号: H05K3/00
- IPC分类号: H05K3/00 ; H05K3/28 ; G03F7/00
摘要:
The invention provides a process for producing a wiring circuit board, which comprises the steps of: (A) forming a conductor layer of a predetermined pattern on an insulating layer; (B) forming a photosensitive solder resist layer on the insulating layer and the patterned conductor layer formed on the insulating layer; (C) disposing a transparent protective film on the photosensitive solder resist layer; and (D) exposing the photosensitive solder resist layer to a light through the transparent protective film.
公开/授权文献
- US07354697B2 Process for producing wiring circuit board 公开/授权日:2008-04-08