发明申请
- 专利标题： Substrate treating apparatus
- 专利标题（中）： 底物处理装置
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申请号： US10942180申请日： 2004-09-16
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公开(公告)号： US20050061441A1公开(公告)日： 2005-03-24
- 发明人: Kenji Hashinoki , Satoshi Yamamoto , Yasufumi Koyama
- 申请人： Kenji Hashinoki , Satoshi Yamamoto , Yasufumi Koyama
- 专利权人： Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人： Dainippon Screen Mfg. Co., Ltd.
- 优先权： JP2003-329925 20030922
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; G03F7/38 ; H01L21/00 ; H01L21/027 ; C23F1/00
摘要：
A substrate treating apparatus is capable of promptly heating substrates after exposure, and avoiding an adverse thermal influence on an exposing apparatus. A developing block includes heating modules for heating exposed substrates. An interface block is interposed between the heating modules and the exposing apparatus to isolate the exposing apparatus from the thermal influence of the heating modules. The interface block has a transport mechanism for transporting the substrates to the heating modules, whereby the exposed substrates are promptly transferred to the heating modules.
公开/授权文献
- US07563323B2 Substrate treating apparatus 公开/授权日：2009-07-21