Invention Application
US20050062138A1 Semiconductor structure with electrically isolated sidewall electrodes and method for fabricating the structure 审中-公开
具有电隔离侧壁电极的半导体结构和用于制造该结构的方法

  • Patent Title: Semiconductor structure with electrically isolated sidewall electrodes and method for fabricating the structure
  • Patent Title (中): 具有电隔离侧壁电极的半导体结构和用于制造该结构的方法
  • Application No.: US10668136
    Application Date: 2003-09-22
  • Publication No.: US20050062138A1
    Publication Date: 2005-03-24
  • Inventor: Kirt Williams
  • Applicant: Kirt Williams
  • Main IPC: B81B3/00
  • IPC: B81B3/00 H01L29/40 H02N1/00
Semiconductor structure with electrically isolated sidewall electrodes and method for fabricating the structure
Abstract:
A semiconductor structure with electrically isolated sidewall electrodes on one or more sides of the structure and a method for fabricating the structure are disclosed. The electrically isolated sidewall electrodes are composed of silicon-based conductive material, e.g., doped polysilicon, which allows the electrodes to be formed on one or more sides of the semiconductor structure by using stop-on-oxide deep reactive-ion etching (DRIE). The electrically isolated sidewall electrodes allow the semiconductor structure to generate electrostatic forces between a side surface of the semiconductor structure and a side surface of a similar semiconductor structure. Thus, the semiconductor structure may be used as a part of an electrostatic actuator in a microelectromechanical system (MEMS) device.
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