Invention Application
- Patent Title: High tolerance embedded capacitors
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Application No.: US10664638Application Date: 2003-09-18
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Publication No.: US20050063135A1Publication Date: 2005-03-24
- Inventor: William Borland , Xin Fang
- Applicant: William Borland , Xin Fang
- Main IPC: H01G4/01
- IPC: H01G4/01 ; H01G4/255 ; H05K1/09 ; H05K1/16 ; H05K3/22 ; H05K3/42 ; H05K3/46 ; H01G4/005
Abstract:
In a printed wiring board, capacitors have electrode layers that may be selectively trimmed to obtain high tolerances. The electrode layers can be formed from a plurality of elongated electrode portions, each of which can be selectively trimmed. The electrode layers can also be formed from interdigitated elongated electrode portions.
Information query
