发明申请
- 专利标题: Substrate support
- 专利标题(中): 基材支持
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申请号: US10990094申请日: 2004-11-16
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公开(公告)号: US20050063800A1公开(公告)日: 2005-03-24
- 发明人: Shinichi Kurita , Wendell Blonigan , Suhail Anwar , Toshio Kiyotake , Hung Nguyen
- 申请人: Shinichi Kurita , Wendell Blonigan , Suhail Anwar , Toshio Kiyotake , Hung Nguyen
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 主分类号: B65G49/07
- IPC分类号: B65G49/07 ; H01L21/205 ; H01L21/68 ; H01L21/687 ; H05K1/14 ; B65G1/00
摘要:
A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.
公开/授权文献
- US07735710B2 Substrate support 公开/授权日:2010-06-15
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