发明申请
US20050066299A1 Method for arranging circuit elements in semiconductor components 审中-公开
在半导体部件中配置电路元件的方法

  • 专利标题: Method for arranging circuit elements in semiconductor components
  • 专利标题(中): 在半导体部件中配置电路元件的方法
  • 申请号: US10845763
    申请日: 2004-05-14
  • 公开(公告)号: US20050066299A1
    公开(公告)日: 2005-03-24
  • 发明人: Michael Wagner
  • 申请人: Michael Wagner
  • 优先权: DE10322088.7 20030515
  • 主分类号: G06F17/50
  • IPC分类号: G06F17/50 H01L21/822 H01L27/118
Method for arranging circuit elements in semiconductor components
摘要:
The problem of the invention, which concerns a method for arranging circuit elements in semiconductor components, in which according to a circuit draft, using a standard cell library, a physical layout is produced, in which the circuit elements are placed in the layout, one after the other, with their components, and with this layout, the circuit elements are structured in the semiconductor component, wherein each of the circuit elements has a driver, to which a driver strength is established, and connecting elements, is to indicate a method with which a placing of the circuit elements can be undertaken in such a way that a functionally reliable timing can be purposefully attained. This is attained in that the sensitivity of the circuit elements for a parasitic electromagnetic influencing is evaluated and in that the circuit elements with the highest sensitivity—that is, the susceptibility for parasitic influencing—are first placed with the shortest possible connecting elements.
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