Invention Application
US20050067697A1 Apparatus for connecting an IC terminal to a reference potential
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用于将IC端子连接到参考电位的装置
- Patent Title: Apparatus for connecting an IC terminal to a reference potential
- Patent Title (中): 用于将IC端子连接到参考电位的装置
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Application No.: US10911381Application Date: 2004-08-04
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Publication No.: US20050067697A1Publication Date: 2005-03-31
- Inventor: Johann-Peter Forstner , Stephan Weber
- Applicant: Johann-Peter Forstner , Stephan Weber
- Applicant Address: DE Munchen
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munchen
- Priority: DE10204403.1 20020204
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/3205 ; H01L21/822 ; H01L23/48 ; H01L23/50 ; H01L23/64 ; H01L27/04
Abstract:
A circuit chip has an apparatus for an electrically conductive connection of a terminal thereof to an external reference potential. The apparatus has a parallel connection of a bonding wire and a semiconductor area formed in a substrate of the circuit chip. The semiconductor area is doped higher than the substrate of the circuit chip.
Public/Granted literature
- US07057271B2 Apparatus for connecting an IC terminal to a reference potential Public/Granted day:2006-06-06
Information query
IPC分类:
