发明申请
US20050069818A1 Absorptive resists in an extreme ultraviolet (EUV) imaging layer 审中-公开
吸收抗紫外线(EUV)成像层

Absorptive resists in an extreme ultraviolet (EUV) imaging layer
摘要:
An embodiment of the present invention includes a technique to provide a highly absorptive resist. A resist is formed using a highly absorbing material. The resist is thinned to a pre-determined thickness used as an imaging layer. The efficiency of a photoactive acid generator (PAG) is improved to capture secondary electrons produced by an ionizing radiation in the resist.
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