发明申请
- 专利标题： Method of manufacturing electronic device and method of manufacturing electro-optical device
- 专利标题（中）： 制造电子装置的方法和制造电光装置的方法
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申请号： US10916621申请日： 2004-08-12
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公开(公告)号： US20050070046A1公开(公告)日： 2005-03-31
- 发明人: Atsushi Saito
- 申请人： Atsushi Saito
- 申请人地址： JP Tokyo
- 专利权人： SEIKO EPSON CORPORATION
- 当前专利权人： SEIKO EPSON CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2003-297652 20030821; JP2004-069557 20040311
- 主分类号： G02F1/1345
- IPC分类号： G02F1/1345 ; G02F1/13 ; G02F1/133 ; H01L21/00 ; H01L21/44 ; H01L21/48 ; H01L21/56 ; H01L21/60 ; H01L23/12 ; H01L23/31 ; H01L23/538 ; H05K3/00 ; H05K3/32
摘要：
A method of manufacturing an electronic device includes: mounting a plurality of electronic components to a thermoplastic resin layer so that the bump electrode is installed in the thermoplastic resin layer, each of the electronic components including a bump electrode; forming a conductor conductively connected with the bump electrode on a surface of the thermoplastic resin layer opposite to a surface on which the electronic components are mounted; and dividing the thermoplastic resin layer in units of each of the electronic components.
信息查询
IPC分类:
