发明申请
- 专利标题： Resilient polishing pad for chemical mechanical polishing
- 专利标题（中）： 弹性抛光垫进行化学机械抛光
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申请号： US10673002申请日： 2003-09-26
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公开(公告)号： US20050070216A1公开(公告)日： 2005-03-31
- 发明人: John Roberts , Laurent Vesier
- 申请人： John Roberts , Laurent Vesier
- 主分类号： B24B37/00
- IPC分类号： B24B37/00 ; B24B29/00 ; B24B37/04 ; B24D13/14 ; H01L21/304 ; B24B19/00
摘要：
A resilient, laminated polishing pad for chemical mechanical polishing is disclosed. The polishing pad includes a base layer and a polishing layer bonded by a hot-melt adhesive. The hot-melt adhesive of the present invention provides a Tpeel strength for the polishing pad of at least greater than 40 Newtons at 305 mm/min, reducing pad delamination.
公开/授权文献
- US07101275B2 Resilient polishing pad for chemical mechanical polishing 公开/授权日：2006-09-05
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