Invention Application
US20050076897A1 Material for diamond sintered body die and diamond sintered body die
有权
金刚石烧结体模具和金刚石烧结体模具的材料
- Patent Title: Material for diamond sintered body die and diamond sintered body die
- Patent Title (中): 金刚石烧结体模具和金刚石烧结体模具的材料
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Application No.: US10497084Application Date: 2003-05-23
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Publication No.: US20050076897A1Publication Date: 2005-04-14
- Inventor: Minoru Yoshida , Takeru Nakashima , Tadashi Yamaguchi
- Applicant: Minoru Yoshida , Takeru Nakashima , Tadashi Yamaguchi
- Priority: JP2002-158400 20020531
- International Application: PCT/JP03/06493 WO 20030523
- Main IPC: B21C3/02
- IPC: B21C3/02 ; B21C3/18 ; B28D5/02 ; B23H1/00
Abstract:
To provide a diamond compact die semi-manufactured product and a diamond compact die that do not crack during die processing. A diamond compact die semi-manufactured product includes a diamond compact and a holding ring. The holding ring is a cylinder composed of a tungsten alloy, and the inner diameter thereof is tapered. The diamond compact is tapered so as to fit to the taper of the cylinder and the diamond compact is press-fitted to the holding ring. For lower cost production, the tapered face of the diamond compact is formed by electric spark machining. The tungsten alloy contains 90% to 97% by weight of tungsten and 3% to 10% by weight of nickel.
Public/Granted literature
- US07131314B2 Material for diamond sintered body die and diamond sintered body die Public/Granted day:2006-11-07
Information query
