发明申请
- 专利标题： Heat sinks
- 专利标题（中）： 散热片
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申请号： US10683829申请日： 2003-10-10
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公开(公告)号： US20050077615A1公开(公告)日： 2005-04-14
- 发明人: Gang Yu , Jian Wang
- 申请人： Gang Yu , Jian Wang
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L51/40 ; H01L51/52 ; H01L23/10
摘要：
An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2 and mm, respectively.
公开/授权文献
- US07109520B2 Heat sinks 公开/授权日：2006-09-19
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