摘要:
An organic electronic device includes electronic components within an array. In one embodiment, the organic electronic device includes a substrate and a first conductive member overlying the substrate and lying at least partly within the array. The first conductive member is at least part of a first power transmission line. The organic electronic device further includes a second conductive member overlying the substrate and lying at least partly within the array. The second conductive member is at least part of a first electrode and is electrically connected to the first conductive member. In another embodiment, an organic active layer has at least a portion lying between the first and second conductive members. In yet another embodiment, a process for using an organic electronic device including an array of radiation-emitting components allows radiation to be emitted from the array at an intensity of at least 1100 cd/m2.
摘要翻译:有机电子器件包括阵列内的电子元件。 在一个实施例中,有机电子器件包括衬底和覆盖衬底并且至少部分地位于阵列内的第一导电构件。 第一导电构件是第一输电线的至少一部分。 有机电子器件还包括覆盖衬底并且至少部分地位于阵列内的第二导电构件。 第二导电构件是第一电极的至少一部分,并且电连接到第一导电构件。 在另一个实施例中,有机活性层具有位于第一和第二导电构件之间的至少一部分。 在另一个实施方案中,使用包括辐射发射部件阵列的有机电子器件的方法允许以至少1100cd / m 2的强度从阵列发射辐射。
摘要:
An optical resonator is provided, and methods for making the same, as well as devices and sub-assemblies including the same. For example, such an electronic device (FIG. 4) may include a first electronic component (172) designed to be photoactive to radiation having a first wavelength and a second electronic component (174) designed to be photoactive to radiation having a second wavelength. The device may also include a cavity that defines an optical resonator having a cavity length such that the optical resonator resonates in successive resonant modes that locate at the first and second wavelengths.
摘要:
A process for forming an electronic device can include providing a first workpiece including an electronic component that includes an electrode and an organic layer, and providing a second workpiece that includes a conductor. The process can also include reflowing a conductive member between the electrode and conductor. In one embodiment, after reflowing, the conductive member can have a width at a point about halfway between the first electrode and the conductor that is wider than a width of the conductive member at a point closer to the electrode or the conductor. In another embodiment, after reflowing, the conductive member can include a void. In still another embodiment, after reflowing, a conductive member can separate into a set of conductive members that lie between the electrode and the conductor.
摘要:
A workpiece can include conductive members that include a material that melts at a temperature no higher than 240° C. In one embodiment, conductive members that are attached to electronic components that each include an electrode and an organic layer that emits radiation, responds to radiation, or a combination thereof, and more particularly, the conductive members are attached to the electrodes of the electronic component. In another embodiment, the conductive members are attached to conductors that are part of or electrically connected to control circuits designed to control electronic components that each include an organic layer that emits radiation, responds to radiation, or a combination thereof.
摘要:
An electronic device can include a first workpiece including at least 4,000 electronic components that each include a corresponding electrode and a second workpiece including at least one conductor. The electronic device can also include at least 4,000 conductive members that are substantially directly bonded to the corresponding electrodes and the at least one conductor.
摘要:
An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
摘要:
An electronic device includes a data processing system and a set of pixels that each include one or more radiation-emitting electronic components, one or more radiation-sensing electronic components, or any combination thereof. The data processing system that is configured to access data regarding the set of pixels and determine at least one calibration value corresponding to the data. The number of the calibration value(s) is less than the number of the pixels within the set. The data processing system is further configured to compare the calibration value(s) to another value and change at least one adjustment factor if the calibration value(s) differs from the other value by more than a predetermined amount. The number of the adjustment factor(s) is less than the number of the pixels within the set. Data processing system readable media and methods for using the electronic device are also described.
摘要:
An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2 and mm, respectively.
摘要:
An electronic device can include a first workpiece including an electronic component that includes an electrode and an organic layer, and a second workpiece that includes a conductor. The electronic device can also include a conductive member between the electrode and conductor. In one embodiment, the conductive member can have a width at a point about halfway between the first electrode and the conductor that is wider than a width of the conductive member at a point closer to the electrode or the conductor. In another embodiment, the conductive member can include a void. In still another embodiment, a set of conductive members may lie between the electrode and the conductor.
摘要:
An electronic device can include a first workpiece, a second workpiece, and a conductive member. The first workpiece can include an electronic component that includes an electrode and an organic layer. The first workpiece can also include a substrate structure lying adjacent to the electronic component. The second workpiece can include a conductor. The conductive member can be substantially directly bonded to the electrode and the first conductor.