发明申请
- 专利标题： Semiconductor device having heat radiation plate and bonding member
- 专利标题（中）： 具有散热板和接合构件的半导体装置
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申请号： US10895947申请日： 2004-07-22
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公开(公告)号： US20050077617A1公开(公告)日： 2005-04-14
- 发明人: Naohiko Hirano , Nobuyuki Kato , Kuniaki Mamitsu , Yoshimi Nakase
- 申请人： Naohiko Hirano , Nobuyuki Kato , Kuniaki Mamitsu , Yoshimi Nakase
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 优先权： JP2003-350814 20031009; JP2003-352513 20031010; JP2003-395572 20031126
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/00 ; H01L23/36 ; H01L23/42 ; H01L23/433 ; H01L23/492 ; H01L23/58
摘要：
A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.
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