An engageable assembly comprising a socket and a heat sink. The socket comprises a surface having an array of mounting holes that receive connector pins of an electronic device in order to mount the electronic device within the perimeter of the socket. The heat sink has a footprint extending beyond the perimeter of the socket and is in thermal contact with the electronic device when it is engaged with the socket. The socket and the heat sink include cooperative alignment tabs and alignment slots located outside the array of mounting holes. A locking lever is pivotally connected to an arm extending from the socket to a position outside of the footprint of the heat sink.