- 专利标题: High performance semiconductor devices fabricated with strain-induced processes and methods for making same
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申请号: US10683901申请日: 2003-10-10
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公开(公告)号: US20050079677A1公开(公告)日: 2005-04-14
- 发明人: Chung-Hu Ke , Wen-Chin Lee , Yee-Chia Yeo , Chih-Hsin Ko , Chenming Hu
- 申请人: Chung-Hu Ke , Wen-Chin Lee , Yee-Chia Yeo , Chih-Hsin Ko , Chenming Hu
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/76 ; H01L21/762 ; H01L21/8238 ; H01L27/092 ; H01L29/10 ; H01L29/76 ; H01L29/78 ; H01L29/80
摘要:
A high performance semiconductor device and the method for making same is disclosed with an improved drive current. The semiconductor device has source and drain regions built on an active region, a length of the device being different than a width thereof. One or more isolation regions are fabricated surrounding the active region, the isolation regions are then filled with an predetermined isolation material whose volume shrinkage exceeds 0.5% after an anneal process. A gate electrode is formed over the active region, and one or more dielectric spacers are made next to the gate electrode. Then, a contact etch stopper layer is put over the device, wherein the isolation regions, spacers and contact etch layer contribute to modulating a net strain imposed on the active region so as to improve the drive current.
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