发明申请
- 专利标题： Integrated circuit with a scalable high-bandwidth architecture
- 专利标题（中）： 具有可扩展高带宽架构的集成电路
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申请号： US10630260申请日： 2003-07-30
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公开(公告)号： US20050080958A1公开(公告)日： 2005-04-14
- 发明人: Erin Handgen , Eri Rentschler , Michael Tayler
- 申请人： Erin Handgen , Eri Rentschler , Michael Tayler
- 主分类号： G06F13/00
- IPC分类号： G06F13/00 ; G06F13/40
摘要：
An integrated circuit component is provided comprising logic capable of being configured to interface with a first companion integrated circuit and to receive information that is communicated from the first companion integrated circuit, which information was communicated to the first companion integrated circuit via a first portion of a system bus. The integrated circuit component further comprises logic capable of being configured to interface with a second companion integrated circuit and to receive information that is communicated from the second companion integrated circuit, which information was communicated to the second companion integrated circuit via a second portion of the system bus
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