Invention Application
- Patent Title: Insulated gate type semiconductor device and method for fabricating the same
- Patent Title (中): 绝缘栅型半导体器件及其制造方法
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Application No.: US10984788Application Date: 2004-11-10
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Publication No.: US20050082609A1Publication Date: 2005-04-21
- Inventor: Hiroshi Inagawa , Nobuo Machida , Kentaro Oishi
- Applicant: Hiroshi Inagawa , Nobuo Machida , Kentaro Oishi
- Assignee: Renesas Tehnology Corp.,Hitachi Tobu Semiconductor Ltd.
- Current Assignee: Renesas Tehnology Corp.,Hitachi Tobu Semiconductor Ltd.
- Priority: JP2001-042352 20010219
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/331 ; H01L21/336 ; H01L21/8234 ; H01L27/04 ; H01L27/088 ; H01L29/06 ; H01L29/12 ; H01L29/417 ; H01L29/739 ; H01L29/78 ; H01L27/108

Abstract:
In an insulated-gate type semiconductor device in which a gate-purpose conductive layer is embedded into a trench which is formed in a semiconductor substrate, and a source-purpose conductive layer is provided on a major surface of the semiconductor substrate, a portion of a gate pillar which is constituted by both the gate-purpose conductive layer and a cap insulating film for capping an upper surface of the gate-purpose conductive layer is projected from the major surface of the semiconductor substrate; a side wall spacer is provided on a side wall of the projected portion of the gate pillar; and the source-purpose conductive layer is connected to a contact region of the major surface of the semiconductor substrate, which is defined by the side wall spacer.
Public/Granted literature
- US07172941B2 Insulated gate type semiconductor device and method for fabricating the same Public/Granted day:2007-02-06
Information query
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